Transcend MTE370T 512GB, TS512GMTE370T - diskuze
Výrobce: Transcend
EAN: 760557858782
TRANSCEND MTE370T 512GB SSD disk M.2 2230, PCIe Gen3 x4 NVMe 1.3 (3D TLC), 2000MB/s R, 1100MB/s W
Transcend's M.2 2230 SSD MTE370T features state-of-the-art 3D NAND technology, which allows 112 layers of 3D NAND flash chips to be vertically stacked. This density breakthrough greatly improves storage efficiency. The MTE370T features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. Applied with the 30µ" gold finger PCB and Corner Bond technology, the MTE370T is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20°C~75°C.
Technologies:
- 30µ” PCB Gold Finger
- Corner Bond
- Extended Temperature
- Dynamic Thermal Throttling
- Thermal Sensor
- Read Disturbance
- Anti-sulfur Technology
- Garbage Collection
- Wear Leveling
- TRIM
- Bad Block Management
- Power Shield (PS)
- Early Move
Firmware Features:
- Supports NVM command
- SLC caching technology
- Dynamic thermal throttling
- Built-in LDPC ECC (Error Correction Code) functionality
- Advanced Global Wear-Leveling and Block management for reliability
- Advanced Garbage Collection
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- TRIM command for bette
Transcend's M.2 2230 SSD MTE370T features state-of-the-art 3D NAND technology, which allows 112 layers of 3D NAND flash chips to be vertically stacked. This density breakthrough greatly improves storage efficiency. The MTE370T features the PCI Express (PCIe) Gen 3 x4 interface and is compatible with NVM Express (NVMe) 1.3 specifications to achieve never-before-seen transfer speeds. Applied with the 30µ" gold finger PCB and Corner Bond technology, the MTE370T is fully tested in-house to guarantee reliability in mission-critical applications, boasting an endurance rating of 3K Program/Erase cycles and an extended operating temperature ranging from -20°C~75°C.
Technologies:
- 30µ” PCB Gold Finger
- Corner Bond
- Extended Temperature
- Dynamic Thermal Throttling
- Thermal Sensor
- Read Disturbance
- Anti-sulfur Technology
- Garbage Collection
- Wear Leveling
- TRIM
- Bad Block Management
- Power Shield (PS)
- Early Move
Firmware Features:
- Supports NVM command
- SLC caching technology
- Dynamic thermal throttling
- Built-in LDPC ECC (Error Correction Code) functionality
- Advanced Global Wear-Leveling and Block management for reliability
- Advanced Garbage Collection
- Supports S.M.A.R.T. function to conduct health monitoring, analysis, and reporting for storage devices
- TRIM command for bette
Cena 3 287 Kč v 1 obchodě
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